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BGA NET for C55 Flash, T608 Flash, 6230 CPU, 8310 / 3310, V208 IC, A68 MIDI, 7688 Flash and many moreProduct reference: BGA-NET-C55-FLASH-T60-R8569 |
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Use for C55 Flash, T608 Flash, 6230 CPU, 8310 / 3310, V208 IC, A68 MIDI, 7688 Flash, A68 Flash, L2000 UEM, V66 Flash, AP-A102 CPU, LU-PS966 CPU, X600 UEM, 6230 UEM, etc. Description: Stainless soldering platforms for SMD, BGA component place tin/soldering ball for mobile phones, such as CPU soldering platform, Flash, RF and RAM BGA IC platform. Support: C55 Flash, T608 Flash, 6230 CPU, 8310 / 3310, V208 IC, A68 MIDI, 7688 Flash, A68 Flash, L2000 UEM, V66 Flash, AP-A102 CPU, LU-PS966 CPU, X600 UEM, 6230 UEM, T191 / 998 CPU, E708 Flash, 7260 CPU, A68 UEM, GD55 CPU, E680 Flash, A760 RAM, E708 UEM, 2688 Flash, 928 / 998, T18 / T28,CDMAX350, 9110 Flash, S308 CPU, T39, 998 / V66 / L2000 / V70, T39 / 8310 Flash,GD90 CPU, NEC68821, A188 CPU, A620 UEM, 3210 / 8810, / CECH16, NEC2100 CPU, 8810 CPU, N188 / N288 CPU, C6688 CPU / C3508 CPU,MSM3100 CPU, CDMA CPU, T191 / 998 UEM, E700 Flash, E630 CPU, GD55 Flash, A760 CPU, V66 / V60 CPU, 928 CPU, V70 Flash, 3310 / 3210 / 8820 / 2400 / 8210 CPU, GD90 Flash, T39 CPU, 6188 CPU, 7210, 8210 / A188 Flash, N100 CPU, 3220 CPU, 9500 RAM. Specifications | ||||||||||||||||||||||||||||||||||||||||||
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